Low Viscosity Epoxy Resin for Electronic Potting Encapsulation | 25 min Working Time | TECHNO POTTING 8038

Low Viscosity Epoxy Resin for Electronic Potting Encapsulation. TECHNO POTTING™ 8038 is a cost-efficient, self-leveling black or clear epoxy resin specifically engineered for electronic potting, component encapsulation, and industrial part casting. Its low-viscosity formulation ensures excellent flow into small cavities and around complex geometries while minimizing air entrapment and shrinkage. With a working time of 25 minutes, this system offers flexibility during application and solidifies into a durable, protective finish.

Formulated with 100% reactive solids, TECHNO POTTING™ 8038 offers excellent UV resistance, a glossy finish, and superior impact resistance. Its RoHS compliance ensures it is safe for use in electronic and environmentally sensitive applications. Thanks to its affordable price point, it is ideal for high-volume or budget-conscious projects without compromising on performance.

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Key Features

• Excellent UV resistance

• Glossy finish

• Strong impact resistance

• Very low viscosity

• Easy to use and apply

• RoHS-compliant

• Cost-effective and suitable for small to medium pours

• Self-leveling black resin system

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Application Instructions

• Storage: Store on a pallet or shelf at 22°C (72°F) and below 60% relative humidity. Do not store directly on the floor.

• Temperature Sensitivity: Cooler environments will increase viscosity; warmer conditions will lower it.

• Pre-Mixing: Mix Part A and Part B separately before combining.

• Mix Ratio: Mix 2 parts A to 1 part B by volume (or 100:42 by weight) slowly with a metal spatula for 5 to 10 minutes, scraping the sides and bottom of the container.

• Pot Life: Do not mix more resin than can be applied within the 25-minute pot life at 22°C for 200g mass.

• Temperature Impact: Warmer temperatures will reduce pot life; cooler temperatures will extend it.

• Clean-Up: Uncured material can be cleaned using T-901 solvent.