Thermally Conductive & Electrically Insulative Electronic Potting Epoxy Resin

Thermally Conductive & Electrically Insulative Electronic Potting Epoxy Resin. Fire Retardant Electronic Potting Epoxy Resin. TECHNO POTTING™ 8109FR, is a two-component, room temperature curing compound designed for potting, encapsulating, and casting applications. Protect your electronic components with TECHNO POTTING™ 8109FR, the fire-proof epoxy potting compound designed to meet UL 94-V-0 specifications. Encapsulate your sensitive electronics and ensure their safety even in high-temperature environments.

Fast-Setting Convenience

Experience the efficiency of TECHNO POTTING™ 8109FR with its fast-setting capabilities. Handle your components within 24 hours post-application or opt for heat curing for final cure in just a few hours, ensuring swift operations and increased productivity.

Key Features of TECHNO POTTING™ 8109FR:

• Fire-Proof: UL 94-V-0 certified for exceptional fire resistance, ensuring utmost safety for electronic components.
• Excellent Durability: Shields components from environmental stressors, ensuring long-term reliability.
• Minimal Shrinkage: Tight seal prevents gaps, maintaining protection for electronics.
• Insoluble: Maintains structural integrity even in harsh conditions.
• Easy to Use: Designed for convenient application in various manufacturing processes.
• Fast Setting: Enables quick handling and processing, enhancing operational efficiency.

By incorporating these properties into our product description, we highlight the key benefits of TECHNO POTTING™ 8109FR, making it an ideal choice for ensuring the safety, durability, and reliability of electronic components.

Advantages of TECHNO POTTING™ 8109FR:

1. Convenient Mixing: Achieve precise formulations with the one-to-one mix ratio by weight.
2. Optimal Flow Properties: Ideal for electronic potting and encapsulation, ensuring uniform coverage and protection.
3. Versatile Cure Schedules: Offers flexibility with ambient temperature cures or faster cures at elevated temperatures, adapting to production needs.
4. Strong Bonding: Exhibits high bond strength across a wide range of substrates, ensuring secure encapsulation and assembly.
5. Exceptional Durability: Withstands thermal shock, fuels, and lubricants, ensuring long-lasting performance in demanding environments.