Polyurethane Potting Resin for Harsh Environment Protection – TECHNO POTTING™ 3046

Two-Component Polyurethane Potting Resin for Electronic Protection

Polyurethane Potting Resin for Harsh Environment Protection. TECHNO POTTING™ 3046 is a high-performance, 100% solids, two-component polyurethane encapsulation system designed for potting and protecting electrical and electronic components exposed to extreme environmental conditions. With superior adhesion to metals and rigid plastics, this formulation creates a durable seal that safeguards sensitive components from moisture, dust, and certain chemicals. Its low viscosity allows for deep penetration into intricate cavities, ensuring complete coverage even in complex-shaped components with varying thicknesses. The low exothermic reaction minimizes internal stresses, making it suitable for delicate components that are heat-sensitive.

TECHNO POTTING™ 3046 complies with the European RoHS directive, ensuring a safer formulation free from restricted hazardous substances.

Polyurethane Potting Resin for Harsh Environment Protection

• Low Viscosity – Ensures maximum infiltration into small cavities and fine interstices.
• Low Exotherm – Prevents damage to sensitive components and minimizes shrinkage.
• Very Low Linear Shrinkage – Provides dimensional stability after curing.
• High Adhesion – Bonds strongly to metal, rigid plastics, and electronic substrates.
• Good Chemical Resistance – Offers protection encapsulation system designed for potting and protecting electrical and electronic components exposed to extreme environmental condition
• Fast Handling Time – Reduces processing time for increased productivity.
• Mechanical Dispensing Compatibility – Can be easily mixed and applied with automatic dispensing systems.
• Filler Compatibility – Can be used with TECHNO FILLER™ 180 and TECHNO FILLER™ 162 to modify properties for specific applications.
• RoHS Compliant – Meets Restriction of Hazardous Substances regulations for electronic applications.

Typical Applications

• Encapsulation of electronic modules and circuit boards
• Potting of transformers, sensors, and coils
• Sealing of automotive, aerospace, and industrial electronics
• Protection of LED drivers and power supplies
• Harsh environment electronics requiring moisture and chemical resistance

Technical Specifications

Processing Guidelines

1. Surface Preparation: Ensure that surfaces are clean, dry, and free of contaminants before application.
2. Mixing: Combine Part A and Part B in a 1:1 ratio by weight. Mix thoroughly until a uniform consistency is achieved.
3. Application: Pour the mixed resin directly into the component housing or cavity. The low viscosity ensures proper infiltration.
4. Curing: Allow the resin to cure at ambient conditions or accelerate curing with heat if required.

For mechanical dispensing systems, use standard two-component metering and mixing equipment compatible with polyurethane formulations.

Storage & Shelf Life

• Store in original sealed containers at room temperature (15-25°C / 59-77°F) in a dry environment.
• Avoid exposure to moisture and humidity, which may affect curing performance.
• Shelf life: 12 months from the date of manufacture when stored under recommended conditions.